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Materials |
Product |
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Description |
IPC 4101/4103 |
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Arlon |
25N |
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Low Loss Ceramic Filled Thermoset Resin |
IPC-4103 /10 |
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33N |
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Polyimide |
/40 /41 |
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35N |
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Polyimide |
/40 /41 |
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85N |
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Bromine-free, High Operating Temp |
/40 /41 |
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37N |
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PrePreg, No-Flow Polyimide |
/42 |
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55NT |
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Epoxy Thermount |
/55 |
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85NT |
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Polyimide Thermount |
/53 |
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CuClad 250GX |
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Woven glass/PTFE composite |
IPC-4103/02 |
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IsoClad 917 |
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PTFE |
/04 |
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51N |
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PrePreg Low-Flow Lead-Free |
/124 |
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47N |
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Modified Epoxy Low Flow Heatsink Bonding |
4101 /21 |
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49N |
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PrePreg Low-Flow Lead-Free |
/24 |
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Dupont |
Pyralux LG 1000 |
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PrePreg Low Flow |
IPC-4203/17 |
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Hitachi |
MCL−E−679F(J) |
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/98 /99 /126 |
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Isola |
408 HR |
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Lead free, Enhanced CAF, electrical performance |
4101 /21 /24 /98 /99 /101 /129 |
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FR406 |
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High Tg, 170 |
/21 /24 /26 |
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370HR |
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Lead free, Low CTE |
/26 (/21 /24 /98 /99 /101 /126) |
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GETEK |
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Low Dk Df, 175 C Tg, for High speed |
/25 |
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A11-104 & 108 |
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PrePreg, No-Flo, heat sink bonding, die cavity boards |
/20 |
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P95 |
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Polyimide |
4101 /40 /41 |
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P96 |
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Polyimide-VO |
4101 /40 /41 |
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Nelco |
N4000-6FC |
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Fast-Cure, High Tg |
/24 /26 /28 |
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N4000-7 |
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Low CTE |
/24* /98 |
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N4000-7ef |
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165ºC Tg Halogen-Free |
/94 |
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N4000-29 |
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Lead free, ROHS, High Tg FR4 |
/24 /26 /83 /98 /99 /126 |
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N4000-13 |
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High Speed, Low Loss |
/29 |
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N4000-13EP |
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Thermal reliability, CAF resistant, high speed low loss |
/29 |
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N4000-13si |
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Signal Integrity, High Speed, Low Loss |
/29 |
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N5000 |
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BT Epoxy |
/30 |
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Nelcote |
E-746 |
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PrePreg, Service temperatures up to 500F |
MIL‐R‐9300B Type II |
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Norplex-Micarta |
NP511 |
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Unclad G10 |
MIL-I-24768/3 |
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Rogers |
RT/duroid 5880 |
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PTFE |
IPC-4103/03/04 |
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6002 |
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PTFE |
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4003C |
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Hydrocarbon Ceramic |
IPC-4103 /10 |
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4230 |
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Hydrocarbon Ceramic |
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4355 |
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Hydrocarbon Ceramic, Antenna grade, ROHS compliant |
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4350B |
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Hydrocarbon Ceramic |
IPC-4103 /11 |
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4403 |
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Hydrocarbon Ceramic |
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4450B |
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Hydrocarbon Ceramic |
IPC-4103 /11 |
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4450F |
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Hydrocarbon Ceramic |
IPC-4103 /11 |
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Holefill |
Product |
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Description |
Type |
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Taiyo |
THP-100DX1 |
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160 C Tg by TMA, CTE 32ppm by TMA |
Non-conductive |
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San-Ei Kagaku |
PHP-900 IR-10F |
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160 C Tg by TMA, CTE 32ppm by TMA |
Non-conductive |
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Peters |
PP 2795 |
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>140 C Tg by TMA, CTE 40ppm |
Non-conductive |
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SD2361 |
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Epoxy |
Non-conductive |
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DuPont |
CB100 |
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91-93.5% solids (solvent based), Ag and Cu fillers |
Conductive (electrically and thermally) |
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Sumitomo Bakelite -
Composite Materials |
X28075-2HT |
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Used to fill Aluminum and Copper cores |
Non-conductive |
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Surface Finish |
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Thickness |
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In-House |
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Hot Air Solder Level (HASL) |
coverage to 1.5 mils |
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Electroless Ni Imm. Gold (ENIG) |
120-250 uIn Ni, 2-8 uIn Au |
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Hot Oil Reflow |
.3 to .5 mils plated |
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IR Fused |
same |
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Selective Solder Strip |
same |
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Electrolytic Ni/Gold |
200-400 uIn Ni, 5-15 uIn Au (30-50 uIn for tabs) |
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Electrolytic Hard Ni |
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Carbon Ink |
Minico Ink |
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Selective Finishes |
Typically a global solderable finish after a selective hard/soft gold finish has
been applied. |
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Subcontract |
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Electroless Bondable Soft Au |
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Electrolytic Gold (Soft) |
For wire bond typically 30-50µIn on selective features. Gold has purity >99.9%,
with 50-90 Knoop hardness. |
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OSP |
.2 to .35 microns |
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Immersion Silver |
6-18 uIn (15 uIn nominal) |
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Lead Free HASL |
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Soldermask |
Product |
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Description |
Type |
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Taiyo |
PSR-4000 HFX PSR-4000 MP PSR-4000 BN |
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Halogen-Free (except Red) |
LPI / LDI |
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Extremely Fast Photospeed |
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Fine Dam Resolution |
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Excellent Resistance to ENIG and Immersion Tin |
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Available in Dark Green, Satin Finish |
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RoHS Compliant and Lead-Free Compatible |
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Excellent Solder Ball Resistance |
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Resistance to No-Clean Flux Residue |
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Available in Dark Green Matte and Satin and Black Matte |
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Excellent Resistance to ENIG and Immersion Tin |
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Hard Surface Finish |
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Available in a Green or Dark Green Semi-Gloss |
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High Viscosity Version for Better Edge Coverage on High Traces |
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Best in Class for Small Hole Clearing |
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Withstands ENIG and Immersion Tin |
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Colors (Black, Blue, Clear, Red, White, and Yellow Semi-Gloss) |
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LDI-4000 |
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For LDI and Conventional Exposing |
LDI (US) |
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Low Halogen |
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Dark Green Satin Finish |
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RoHS Compliant |
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Compatable with Lead-Free Processing |
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Fine Dam Resolution |
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Excellent Small Hole Clearing |
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Wide Processing Window |
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Excellent Resistance to ENIG and Immersion Tin |
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DuPont |
Vacrel 8100 |
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3 - 4 mils thick |
Photopolymer Dry Film |
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Electra |
EMP 110 |
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Carapace Family, Green |
LPI |
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Rohm&Haas |
ConforMask 2500 |
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IPC-SM-840B Class 3 and IPC-SM-840C Class T&H, MIL-P-55110D and Bellcore, High
gloss |
Photopolymer Dry Film |
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Dynamask 5000 |
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IPC SM840C Class T & H, Mil P55110D and Bellcore |
Photopolymer Dry Film |
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Metal Cores |
Product |
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Description |
Type |
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Schlenk |
CIC |
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Invar foil with copper plating and/or Cu/Zn-Treatment on both sides. |
IPC-CF-152/2 CIC W X X |
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Bergquist Co |
T-Clad |
This is often aluminum, but other metals such as copper may also be used. The
most widely used base material thickness is 0.062" (1.6mm) in aluminum, although
many thicknesses are available. |
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Aluminum Cores |
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Copper Cores |
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Stainless Steel |
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Heatsinks |
Product |
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Description |
Type |
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Copper |
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Aluminum |
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Laminate Composite |
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Composite / Laminate / CuFilled / Milled |
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