Manufacturing Capabilities:
- Rigid PCBs (1-40 layers)
- High Density Interconnects (HDI)
- Microvia
- Controlled Impedance
- Blind Vias
- Buried Vias
- Ball Grid Array (BGA)
- Plug and Cap (Holefill)
- Metal Core
- Heat sink Bonding
- Netlist Electrical Testing
- Sequential Lamination
- Edge Plating
- Embedded Capacitance
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Manufacturing Materials:
- FR4 High Tg
- FR5
- Lead Free
- BT
- Getek
- High Speed Low Loss
- Roger’s High Frequency
- Thermount
- CIC
- PTFE
- Metal Core
- Heat Sink
- Polyimide
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