Technology Overview

Manufacturing Capabilities:

  • Rigid PCBs (1-40 layers)
  • High Density Interconnects (HDI)
  • Microvia
  • Controlled Impedance
  • Blind Vias
  • Buried Vias
  • Ball Grid Array (BGA)
  • Plug and Cap (Holefill)
  • Metal Core
  • Heat sink Bonding
  • Netlist Electrical Testing
  • Sequential Lamination
  • Edge Plating
  • Embedded Capacitance

Manufacturing Materials:

  • FR4 High Tg
  • FR5
  • Lead Free
  • BT
  • Getek
  • High Speed Low Loss
  • Roger’s High Frequency
  • Thermount
  • CIC
  • PTFE
  • Metal Core
  • Heat Sink
  • Polyimide