Materials |
Product |
|
Description |
IPC 4101/4103 |
|
|
|
|
|
Arlon |
25N |
|
Low Loss Ceramic Filled Thermoset Resin |
IPC-4103 /10 |
33N |
|
Polyimide |
UL-94 V0 |
35N |
|
Polyimide |
/40 /41 |
37N |
|
PrePreg, No-Flow Polyimide |
/42 |
55NT |
|
Epoxy Thermount |
/55 |
85N |
|
Bromine-free, High Operating Temp |
/40 /41 |
85NT |
|
Polyimide Thermount |
/53 |
CuClad 250GX |
|
Woven glass/PTFE composite |
IPC-4103/02 |
IsoClad 917 |
|
PTFE |
/04 |
51N |
|
PrePreg Low-Flow Lead-Free |
/124 |
49N |
|
PrePreg Low-Flow Lead-Free |
/24 |
Dupont |
Pyralux LG |
|
PrePreg Low Flow |
IPC-4203/17 |
Gore |
SPEEDBOARD C |
|
low Dk BT resin in toughening matrix |
|
Isola |
IS415 |
|
Lead free, Enhanced CAF, electrical performance |
/24 (/21 /26 /28 /121 /124 /129) |
FR406 |
|
High Tg |
/21 /24 /26 |
FR406HR |
|
Lead Free (No phenolics) |
/21 /24 /26 /28 /121 |
370HR |
|
Lead free, Low CTE |
/26 (/21 /24 /98 /99 /101 /126) |
GETEK |
|
Low Dk Df, 175 C Tg, for High speed |
/25 |
A11 |
|
PrePreg, No-Flo, heat sink bonding, die cavity boards |
/20 |
Nelco |
N4000-6FC |
|
Fast-Cure, High Tg |
/24 /26 /28 |
N4000-7 |
|
Low CTE |
/24* /98 |
N4000-7ef |
|
165ºC Tg Halogen-Free |
/94 |
N4000-29 |
|
Lead free, ROHS, High Tg FR4 |
/24 /26 /83 /98 /99 /126 |
N4000-13 |
|
High Speed, Low Loss |
/29 |
N4000-13EP |
|
Thermal reliability, CAF resistant, high speed low loss |
/29 |
N4000-13si |
|
Signal Integrity, High Speed, Low Loss |
/29 |
N5000 |
|
BT Epoxy |
/30 |
Nelcote |
E-746 |
|
PrePreg, Service temperatures up to 500F |
MIL‐R‐9300B Type II |
Norplex-Micarta |
NP511 |
|
Unclad G10 |
MIL-I-24768/3 |
Rogers |
RT/duroid 5880 |
|
PTFE |
IPC-4103/03/04 |
|
6002 |
|
PTFE |
|
|
4003C |
|
Hydrocarbon Ceramic |
IPC-4103 /10 |
|
4230 |
|
Hydrocarbon Ceramic |
|
|
4232 |
|
Halogen free, Antenna grade |
|
|
4350B |
|
Hydrocarbon Ceramic |
IPC-4103 /11 |
|
4403 |
|
Hydrocarbon Ceramic |
|
|
4450B |
|
Hydrocarbon Ceramic |
IPC-4103 /11 |
|
4450F |
|
Hydrocarbon Ceramic |
IPC-4103 /11 |
|
|
|
|
|
Holefill |
Product |
|
Description |
Type |
|
|
|
|
|
Taiyo |
THP-100DX1 |
|
160 C Tg by TMA, CTE 32ppm by TMA |
Non-conductive |
San-Ei Kagaku |
PHP-900 IR-10F |
|
160 C Tg by TMA, CTE 32ppm by TMA |
Non-conductive |
Peters |
PP 2795 |
|
>140 C Tg by TMA, CTE 40ppm |
Non-conductive |
|
SD2361 |
|
Epoxy |
Non-conductive |
DuPont |
CB100 |
|
91-93.5% solids (solvent based), Ag and Cu fillers |
Conductive (electrically and thermally) |
Sumitomo Bakelite - Composite Materials |
X28075-2HT |
|
Used to fill Aluminum and Copper cores |
Non-conductive |
|
|
|
|
|
Surface Finish |
|
|
|
Thickness |
|
|
|
|
|
|
In-House |
|
Hot Air Solder Level (HASL) |
coverage to 1.5 mils |
|
|
|
Electroless Ni Imm. Gold (ENIG) |
120-250 uIn Ni, 2-8 uIn Au |
|
|
|
Hot Oil Reflow |
.3 to .5 mils plated |
|
|
|
IR Fused |
same |
|
|
|
Selective Solder Strip |
same |
|
|
|
Electrolytic Ni/Gold |
200-400 uIn Ni, 5-15 uIn Au (30-50 uIn for tabs) |
|
|
|
Electrolytic Hard Ni |
|
|
|
|
Carbon Ink |
Minico Ink |
|
|
|
Selective Finishes |
Typically a global solderable finish after a selective hard/soft gold finish has
been applied. |
|
Subcontract |
|
Electroless Bondable Soft Au |
|
|
|
|
Electrolytic Gold (Soft) |
For wire bond typically 30-50µIn on selective features. Gold has purity >99.9%,
with 50-90 Knoop hardness. |
|
|
|
OSP |
.2 to .35 microns |
|
|
|
Immersion Silver |
6-18 uIn (15 uIn nominal) |
|
|
|
Lead Free HASL |
|
|
|
|
|
|
Soldermask |
Product |
|
Description |
Type |
|
|
|
|
|
Taiyo |
PSR-4000 HFX |
|
Halogen-Free (except Red)
Extremely Fast Photospeed
Fine Dam Resolution
Excellent Resistance to ENIG and Immersion Tin
Available in Dark Green, Satin Finish
RoHS Compliant and Lead-Free Compatible |
LPI / LDI |
PSR-4000 MP |
|
Available in Dark Green Matte and Satin and Black Matte
Excellent Solder Ball Resistance
Resistance to No-Clean Flux Residue
Excellent Resistance to ENIG and Immersion Tin
Find Dam Resolution
Hard Surface Finish
RoHS Compliant and Lead-Free Compatible |
LPI |
PSR-4000 BN |
|
Available in a Green or Dark Green Semi-Gloss
High Viscosity Version for Better Edge Coverage on High Traces
Best in Class for Small Hole Clearing
Fine Dam Resolution
Withstands ENIG and Immersion Tin
RoHS Compliant and Lead-Free Compatible |
LPI |
|
colors (Black, Blue, Clear, Red, White, and Yellow Semi-Gloss) |
|
LDI-4000 |
|
For LDI and Conventional Exposing
Low Halogen
Dark Green Satin Finish
RoHS Compliant
Compatable with Lead-Free Processing
Fine Dam Resolution
Excellent Small Hole Clearing
Wide Processing Window
Excellent Resistance to ENIG and Immersion Tin |
LDI (US) |
DuPont |
Vacrel 8100 |
|
3 - 4 mils thick |
Photopolymer Dry Film |
Electra |
EMP 110 |
|
Carapace Family, Green (Black, Blue, Red, Yellow) |
LPI |
|
|
|
|
|
Rohm&Haas |
ConforMask 2500 |
|
IPC-SM-840B Class 3 and IPC-SM-840C Class T&H, MIL-P-55110D and Bellcore, High
gloss |
Photopolymer Dry Film |
Dynamask 5000 |
|
IPC SM840C Class T & H, Mil P55110D and Bellcore |
Photopolymer Dry Film |
|
|
|
|
|
Metal Cores |
Product |
|
Description |
Type |
|
|
|
|
|
Schlenk |
CIC |
|
Invar foil with copper plating and/or Cu/Zn-Treatment on both sides. |
IPC-CF-152/2 CIC W X X |
Bergquist Co |
T-Clad |
|
This is often aluminum, but other metals such as copper may also be used. The
most widely used base material thickness is 0.062" (1.6mm) in aluminum, although
many thicknesses are available. |
|
|
Aluminum Cores |
|
|
|
|
Copper Cores |
|
|
|
|
Stainless Steel |
|
|
|
|
|
|
|
|
Heatsinks |
Product |
|
Description |
Type |
|
|
|
|
|
|
Copper |
|
|
|
|
Aluminum |
|
|
|
|
Laminate Composite |
|
|
|
|
Composite / Laminate / CuFilled / Milled |
|
|
|