|
Board Construction
|
Standard
|
Advanced
|
|
Number of Layers
|
0-38
|
40+
|
|
Finished Board Thickness
|
.018 to .165
|
(< .018) and (.166 to .250)
|
|
Finished Board Thickness Tolerance
|
+/- 10%
|
+/- 5%
|
|
Cavity Boards (requires engineering review)
|
|
non-plated and plated
|
|
Plated-Edges
|
Yes
|
Selective
|
|
Castellated Holes (Half Holes)
|
non-plated
|
plated
|
|
Sequential Laminations
|
1 to 2
|
3+
|
|
OL Cu Foil
|
1/2 oz
|
1/8 oz
|
|
Build up Technology
|
Staggered uVias
|
Buried/Blind / Stacked uVias
|
|
Controlled Impedance
|
+/- 10%
|
< ±10%
|
|
|
|
|
Mechanical Drilling
|
Standard
|
Advanced
|
|
Min Drill Size
|
0.008
|
0.0059
|
|
Hole Location Tolerance
|
> .006 DTP
|
.003-.006 DTP
|
|
Hole Tolerance:
|
|
|
|
Plated
|
+-.003
|
+-.0025 (+-.002 ENIG)
|
|
Press-Fit (after Cu plate)
|
+-.0025
|
+-.002
|
|
Non-Plated
|
+-.002
|
+-.001
|
|
vias
|
+.003 / -(hole size)
|
|
|
Controlled-Depth Back Drilling
|
+/- .005
|
+/- .002
|
|
Hole to Etched Feature (drill to pad)
|
.004 DTP
|
.002-.004 DTP
|
|
|
|
|
Laser Drilling
|
Standard
|
Advanced
|
|
Min hole size
|
0.006
|
0.004
|
|
Microvia pad sizes
|
.011/.012
|
.010/.011
|
|
Blind-to-1 Layer Down
|
Yes
|
|
|
Blind-to-2 Layer Down
|
|
Yes
|
|
Aspect Ratio
|
.5:1
|
>=.6:1
|
|
Build Up Technology (IPC-2226 5.2)
|
1C1
|
2C2
|
|
|
|
|
Hole Fill
|
Standard
|
Advanced
|
|
Non-Conductiive
|
Yes
|
|
|
Conductive
|
Yes
|
|
|
Resin Fill
|
Yes
|
|
|
Plated Shut uVia
|
|
Yes
|
|
|
|
|
Cu Plating
|
Standard
|
Advanced
|
|
Thru-Holes
|
Class 2&3
|
Class 3/A
|
|
Blind vias
|
Class 2&3
|
Class 3/A
|
|
Buried vias
|
Class 2&3
|
Class 3/A
|
|
Microvias
|
Class 2&3
|
Class 3/A
|
|
Plasma Etchback
|
Yes
|
|
|
|
|
|
SolderMask
|
Standard
|
Advanced
|
|
Registration
|
± 0.002"
|
± 0.0015"
|
|
Dams and Webs (green)
|
0.003
|
0.0025
|
|
Dams and Webs (colors)
|
0.0035
|
0.003
|
|
min Clearance/Coverage on AW
|
.003 / .004
|
.002 / .003
|
|
|
|
|
Nomenclature
|
Standard
|
Advanced
|
|
White (Ink Jet)
|
0.008
|
0.006
|
|
Available Colors Yellow, Black, and Red
|
0.008
|
0.008
|
|
Etched (based on Cu weight)
|
see line width
|
see line width
|
|
|
|
|
Fabrication
|
Standard
|
Advanced*
|
|
Hole to Routed Edge
|
± .005
|
< ± .005
|
|
Hole to Adjacent Etched Feature
|
± .0085
|
< ± .0085
|
|
Min Routed Radius
|
0.016
|
.008 for thin panels
|
|
Milled Edges/Controlled-Depth Milling
|
± .005
|
± .002
|
|
Bevel
|
Yes
|
|
|
Countersink
|
Yes
|
|
|
Counterbore
|
Yes
|
|
|
* = Vision system alignment
|
|
|
|
|
|
|
Electrical Test
|
Standard
|
Advanced
|
|
Characteristic Impedance
|
36-100
|
|
|
(Single Ended)
|
±10%
|
< ±10%
|
|
Differential Impedance
|
Edge Coupled
|
|
|
Broad-Side Coupled
|
|
|
50-140Ω
|
|
|
Continuity Resistance
|
10Ω
|
<10Ω Ω
|
|
Isolation Isolation
|
10 M
|
|
|
Voltage
|
10 to 1000V
|
|
|
Test Point Density
|
300 / in2 (Grid)
|
|
|
580 / in2 (Split Net Grid)
|
|
|
1400+ / in2 Flying Probe
|
|
|
HiPot
|
500V
|
1000V
|
|
|
|
|
Quality Systems
|
Standard
|
Advanced
|
|
IPC-6012
|
Class 2,3 & 3A
|
|
|
MIL-PRF-55110
|
Certified
|
Certified
|
|
NHB 5300 (N.A.S.A.)
|
Certified
|
Certified
|
|
ISO 9001:2000
|
Certified
|
Certified
|
|
AS9100
|
Certified
|
Certified
|
|
U.L. Listing
|
UL-94 V0
|
|
|
Statistical Process Control:
|
|
|
|
Implementation
|
Computer Based
|
Computer Based
|
|
Chemical Process Control
|
Yes
|
Yes
|
|
Laboratory Process Control
|
Yes
|
Yes
|
|
Cleanliness Controls
|
Yes
|
Yes
|